Semiconductor Wafer Defect Classification
The Challenge: Identifying nanometer-scale anomalies during photolithography where the signal-to-noise ratio is exceptionally low and the cost of a false negative is catastrophic.
The Solution: We deploy Vision Transformers (ViT) and ensemble-based CNNs that ingest high-resolution SEM imagery. Our models distinguish between critical bridging defects and benign surface noise with 99.99% accuracy, significantly reducing wafer scrap rates and optimizing fab throughput.